Angstrom Engineering Nexdep Sputtering and Evaporation Cluster

Capabilities

• Materials: Dielectrics, semiconductors, metals, metal oxides, non-conducting materials, magnetic materials, etc. (capable of reactive sputtering, co-sputtering)
• Sample size: 6 in wafers, 4 in wafers, pieces.
• Power: 1 RF source and 1 DC source for sputtering, separated source for evaporation.
• Number of gun: 3 sputtering guns (including 1 magnetron gun for magnetic materials). 2 thermal resistive boats, 1 low power crucible for organics evaporation, 1 electron beam evaporation source with 6 crucibles.
• Heating: IR backplate, up to 400C
• Control: automated by software Aeres
• Glove box integrated.